摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method for a needle point of a probe card which method eliminates a need of a needle point polisher attached to a probe device, and to provide the probe device. SOLUTION: The probe card 30 is used to measure the electric characteristics of an IC chip 1 built in an product area of a wafer W, and the method is provided for polishing the point of the probe pin 32 of the probe card 30. According to the method, the point of the probe pin 32 is pressed to the wafer W and is polished in a nonproduct area of the wafer W. Compared to a conventional technique, the method does not require a polishing plate and polishing paper that are conventionally attached to a probe device, and can eliminate costs and trouble to take to procure and replace the polishing plate and polishing paper. COPYRIGHT: (C)2007,JPO&INPIT
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