| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method with which wafer processing accuracy can be improved by appropriately checking a cutting state of a wafer outer periphery. SOLUTION: In a wafer processing method before cutting an outer periphery of a wafer 12, a test wafer 30 held by a test wafer holding means 40 is cut by a cutting blade 22. The surface of the test wafer 30 is then imaged by an imaging means 50, the cut of the test wafer 30 is recognized, and information data of the cut are obtained. Furthermore, on the basis of the information data, the cutting blade 22 is controlled into proper state. The outer periphery of the wafer 12 is cut in a circumferential direction thereafter by the cutting blade 22 controlled into the state, and an outer peripheral cut surface is formed. Thus, the cutting state of the outer periphery of the wafer 12 can be checked indirectly by checking the cut of the test wafer 30, thereby improving processing accuracy of the wafer 12. COPYRIGHT: (C)2007,JPO&INPIT
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