| 摘要 |
PROBLEM TO BE SOLVED: To provide a simple filling method of a reinforcing resin whereby the penetrance of the reinforcing resin can be almost made the same independently of seasons and manufacturing points in the case of mounting a BGA semiconductor package onto a printed wiring board, so as to be capable of making the quality of the strength constant. SOLUTION: Wall members (side wall parts of a frame) 22 each for surrounding at least a corner of the BGA semiconductor package 1, and a plurality of projections 13 projected between each inner wall face of each wall member 22 and each side face of the BGA semiconductor package 1, are provided on the printed wiring board 11. Then the reinforcing resin is filled between each inner wall face of each wall member 22 and each projection 13 on the printed wiring board 11. The penetration speed of the reinforcing resin to gaps between the printed wiring board 11 and the BGA semiconductor package 1 can be controlled by changing the number of the projections 13 and the interval of the projections 13 in a direction along the side faces of the BGA semiconductor package 1. COPYRIGHT: (C)2007,JPO&INPIT
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