发明名称 METHOD OF FORMING CONDUCTIVE POLYMER LAYER
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a conductive polymer layer which forms a conductive polymer having improved stability, thereby improving stability of the conductive polymer working as a dielectric of a solid electrolytic capacitor, preventing deterioration of leakage current characteristics and improving a yield and reliability. SOLUTION: A plurality of plate-like or foil-like substrates are arranged in parallel and dipped into a material liquid for forming a conductive polymer, thereby forming the conductive polymer layer on the surface of the substrates. In this method, an surface interval (d) between the plate or foils is set at a value of not less than 20 times the thickness (t) of the plate or foil. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007095935(A) 申请公布日期 2007.04.12
申请号 JP20050282275 申请日期 2005.09.28
申请人 SHOWA DENKO KK 发明人 OOHATA HIDEKI
分类号 H01G9/028;H01G9/00;H01G9/04;H01G9/052 主分类号 H01G9/028
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