发明名称 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for gettering a metal element for accelerating crystallization by forming an amorphous silicon film containing a rare gas at high speed without damaging to a crystalline semiconductor film. SOLUTION: The crystalline semiconductor film containing an element for accelerating crystallization of a semiconductor film is formed on a substrate having an insulating surface. An oxide film is formed on the crystalline semiconductor film. By using a plasma processing apparatus for generating a plasma having the electron temperature of 0.5 eV to 1.5 eV and the electron concentration of 1.0×10<SP>11</SP>cm<SP>-3</SP>to 1.0×10<SP>13</SP>cm<SP>-3</SP>, the amorphous silicon film containing a rare gas element is formed on the oxide film, and then the crystalline semiconductor film, the oxide film and the amorphous silicon film containing the rare gas are heated to remove the element for accelerating crystallization of the semiconductor film from the crystalline semiconductor film, in a method for manufacturing a semiconductor device. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007096281(A) 申请公布日期 2007.04.12
申请号 JP20060226023 申请日期 2006.08.23
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 KAKEHATA TETSUYA
分类号 H01L21/20;G02F1/1368;H01L21/336;H01L29/786 主分类号 H01L21/20
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