| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder bump structure solving both metallurgical problems and problems on mechanical stability in flip chip technique. <P>SOLUTION: In a semiconductor device 100 provided with an interconnecting layer arranged on a semiconductor substrate, an inert layer 122 is arranged on the interconnecting layer 115, and a support opening 125 of the solder bump 128 is formed in the inert layer 122. A plurality of support pillars 124 including a conductor material are arranged in the support opening 125 of the solder bump 128. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
