| 发明名称 |
WAFER LEVEL LASER MARKING SYSTEM FOR ULTRA-THIN WAFERS USING SUPPORT TAPE |
| 摘要 |
A wafer level marking system is provided including: providing a wafer, a wafer frame, and a support tape; mounting the wafer and the wafer frame on the support tape; and marking the wafer through the support tape.
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| 申请公布号 |
US2007080450(A1) |
申请公布日期 |
2007.04.12 |
| 申请号 |
US20050163156 |
申请日期 |
2005.10.07 |
| 申请人 |
STATS CHIPPAC LTD. |
发明人 |
KUAN HEAP HOE;DO BYUNG TAI |
| 分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 地址 |
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