| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic substrate capable of suppressing the warping deformation upon sintering in an aluminum nitride multilayer substrate. <P>SOLUTION: This manufacturing method of the ceramic substrate on which electronic components or semiconductor devices are mounted comprises the step S1 of forming ceramic green sheets, the step S3 of printing a conductor wiring pattern on each of a plurality of ceramic green sheets, the step S4 of forming a lamination by laminating the plurality of printed ceramic green sheets, the step S5 of mounting the lamination on a setter after placing a plate body consisting of an aluminum nitride baked body on the periphery of the lamination, and the step S6 of sintering the lamination at the highest temperature of 1,650-1,800°C after degreasing the ceramic green sheets at temperatures of 1,300-1,400°C in a non-oxidizing atmosphere metal baking furnace consisting of metallic heating elements. <P>COPYRIGHT: (C)2007,JPO&INPIT |
