| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor devices capable of obtaining a larger number of semiconductor devices than before, even when using the same lamination process as before. <P>SOLUTION: A structure 100 is formed, comprising a substrate 9, and at least one chip 12 laminated on the substrate 9. The structure 100 is divided into a plurality of divided structures 110, 120, 130, 140. Respective divided structures 110, 120, 130, 140 constitute a single semiconductor device. A laminated structure 100, formed by using available lamination method, is divided into the plurality of divided structures 110, 120, 130, 140 by using the available method, thus increasing the number of obtainable semiconductor devices by the number of divided structures. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
