| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for electric power which mitigates a stress in the solder joint between a metal terminal and a circuit substrate, by keeping the thickness of solder between the metal terminal and the circuit substrate in constant. SOLUTION: The semiconductor device is provided with a chip 1, metal terminals 7b, 7c electrically connected to the electrode of the chip 1, and a circuit substrate 3 mounting chip mounting unit 3a for mounting the chip 1 and the metal terminals 7b, 7c while having terminal mounting units 3b, 3c with a metal circuit formed thereon. In this case, one end 7d of the metal terminals 7b, 7c is opposed in parallel to the surfaces of the metal circuits 3b, 3c, and both of them are bonded by solders 10b, 10c between them. At least one projection 9 for maintaining a space is formed on the bent part at one end of the metal terminals 7b, 7c or the surfaces of the metal circuits 3b, 3c opposed to the bent part. COPYRIGHT: (C)2007,JPO&INPIT |
