发明名称 HEAT-SHRINKABLE HOLE-CONTAINING FILM, MOLDING USING THE FILM AS SUBSTRATE, AND HEAT-SHRINKABLE LABEL AND CONTAINER
摘要 PROBLEM TO BE SOLVED: To provide a heat-shrinkable hole-containing film which is reduced in bulk density and superior in printing aptitude, high rigidity, fracture resistance, and shrinkage characteristics, a molding using the film, and to provide a container fitted with a heat-shrinkable label. SOLUTION: An unoriented laminated film constituted of at least two layers of a layer (I) comprising a polylactic acid resin composition and a polyolefin resin composition immiscible in the polylactic acid resin composition and a layer (II), containing the polylactic acid resin composition as the main component is stretched in at least one direction. In the layer (I), the aspect ratio of the direction, crossing at right angles to the main shrinkage direction of a dispersed domain, made of a component B dispersed in a matrix made of a component A to the main shrinkage direction, is 5-50, and the heat-shrinkage factor in the main shrinkage direction of the laminated film, when the film is immersed in water of 80°C for 10 s is at least 20%. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007090876(A) 申请公布日期 2007.04.12
申请号 JP20060236715 申请日期 2006.08.31
申请人 MITSUBISHI PLASTICS IND LTD 发明人 MIYASHITA AKIRA;MATSUI JUN;YAMADA TAKEMIKI
分类号 B32B27/36;B29C61/06;B29K23/00;B29K67/00;B29K105/02;B29L9/00;B32B7/02;B32B27/32 主分类号 B32B27/36
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