发明名称 MULTILAYER CERAMIC ASSEMBLED SUBSTRATE MANUFACTURING METHOD THEREOF, MULTILAYER AND MULTILAYER CERAMIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a multilayer ceramic assembled substrate according to a non-shrink process and having good handleability and excellent dividability, and to provide a multilayer ceramic substrate scarcely having defects such as cracking etc. in the end face thereof. SOLUTION: Dividing grooves in the vertical and horizontal directions are formed in both surfaces or one surface of a non-sintered multilayer ceramic body wherein green sheets are laminated for the substrate consisting of low temperature sintering material containing ceramic. A restraint layer, whose main component being inorganic particles which will not be sintered at the sintering temperature of the non-sintered multilayer ceramic body, is provided in close contact with both surfaces or one surface of the non-sintered multilayer ceramic body to form a lamination. The multilayer ceramic assembled substrate is formed by removing the restraint layer after the lamination is sintered at the temperature capable of sintering the non-sintered multilayer ceramic body. In the multilayer ceramic assembled substrate after the sintering, at least one dividing groove therein has nearly U-shaped cross section. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007095862(A) 申请公布日期 2007.04.12
申请号 JP20050281211 申请日期 2005.09.28
申请人 HITACHI METALS LTD 发明人 UEDA ITARU;IKEDA HATSUO;KURIHARA KOICHIRO
分类号 H05K3/46;H05K3/00 主分类号 H05K3/46
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