| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal transfer plate usable for producing a multi-layered printed wiring board which solves problems wherein large damage is given to a copper wiring pattern in a final soft etching process and inter-line insulation reliability is low since unwanted base copper layer between the copper wiring patterns can not be completely removed. SOLUTION: A method for manufacturing the multi-layered printed wiring board has a pattern forming process (3) of forming the copper wiring patterns, etc., by a transfer process of plating which forms a plating film in a recessed pattern of a transfer plate by making the metal transfer plate which is covered with an insulating layer except the recessed pattern; and a sticking process for an insulating substrate as a second layer, a second transfer process and a via-hole forming process are repeated for required times. COPYRIGHT: (C)2007,JPO&INPIT
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