| 摘要 |
An apparatus for endpoint detection during polish, being used to monitor the surface polishing status of a polishing surface of a workpiece, is disclosed, which comprises: a probe, being positioned above the workpiece by a height; and at least a sensing element, being disposed on the probe at a position corresponding to the polishing surface, capable of sensing the thickness variation of the workpiece during a polishing process as it is performing a surface dynamic scan upon the workpiece in rotating while it is being driven to proceed a linear motion of displacement. Preferably, the sensing element can be a device selected from the group consisting of an optical sensor, an eddy current sensor and the combination of the two for carrying out optical detection and magnetic flux detection. It is noted that the apparatus for endpoint detection of the invention not only is advantaged in its all-zone detection ability, but also it has enhanced detection accuracy with respect to different metal layer of different thickness.
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