PLATING APPARATUS, PLATING CUP AND CATHODE RING

摘要

A plating apparatus ( 10 ) provided with: a plating vessel ( 61 a to 61 d) having a cylindrical side wall ( 361 ) for containing a plating liquid; a substrate holding mechanism ( 74 a to 74 d) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring ( 80 ) provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode ( 83 ) to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism ( 45 ) for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantially flush with the upper edge of the plating vessel without interference between the upper edge portion of the plating vessel and the cathode ring.