发明名称 |
Copper-tin-oxygen alloy plating |
摘要 |
The present invention relates to a Cu-Sn-O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu-Sn-O alloy plating that has a blackish color tone without containing any controlled substances.
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申请公布号 |
US2007082216(A1) |
申请公布日期 |
2007.04.12 |
申请号 |
US20060602418 |
申请日期 |
2006.11.20 |
申请人 |
YKK SNAP FASTENERS JAPAN CO., LTD. |
发明人 |
URATA KAZUYA;KITAGAWA KAZUHIRO;OGAWA YUKIO;HASEGAWA KENJI |
分类号 |
G01K5/66;A44B17/00;A44C27/00;C25D7/00 |
主分类号 |
G01K5/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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