发明名称 |
Surface preparation for selective silicon fusion bonding |
摘要 |
An apparatus and method for a silicon-based Micro-Electro Mechanical System (MEMS) device, including a pair of silicon cover structures each having a substantially smooth and planar contact surface formed thereon; a silicon mechanism structure having a part thereof that is movably suspended relative to a relatively stationary frame portion thereof, the frame portion being formed with substantially parallel and spaced-apart smooth and planar contact surfaces; a relatively rough surface disposed between the contact surfaces of the covers and corresponding surfaces of the movable part of the mechanism structure; and wherein the contact surfaces of the cover structures form silicon fusion bond joints with the respective contact surfaces of the mechanism frame.
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申请公布号 |
US2007082420(A1) |
申请公布日期 |
2007.04.12 |
申请号 |
US20050247700 |
申请日期 |
2005.10.11 |
申请人 |
HONEYWELL INTERNATIONAL, INC. |
发明人 |
MILNE JAMES C.;MCNALLY LEONARD J. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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