发明名称 RESIN MOLDING APPARATUS
摘要 <p>A resin molding apparatus that without the use of any lubricant, realizes smooth opening and closing of metal mold, thereby attaining production of high-precision molded items. There is provided a resin molding apparatus comprising mobile-side platen (35) retaining mobile-side metal mold (30) connected via tie bars (40) to fixed-side platen (25) retaining fixed-side metal mold (20) and comprising bushes (36) disposed in the mobile-side platen (35) which are movable along the tie bars (40). At least either the outer circumferential surface of the tie bars (40) or the inner circumferential surface of the bushes (36) is provided with low-friction surface treatment.</p>
申请公布号 WO2007039982(A1) 申请公布日期 2007.04.12
申请号 WO2006JP315532 申请日期 2006.08.04
申请人 KONICA MINOLTA OPTO, INC.;SEKIHARA, KANJI;HARA, SHINICHIROU 发明人 SEKIHARA, KANJI;HARA, SHINICHIROU
分类号 B29C33/22;B29C33/60;B29C45/64 主分类号 B29C33/22
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