SEMICONDUCTOR CHIP CUTTING METHOD AND SEMICONDUCTOR CHIP

摘要

A structure material (6) is formed on a silicon substrate (4), and a holding film (8) is formed on a side of the structure material (6) on the silicon substrate (4). A through hole (5) reaching the structure material (6) on one side of the silicon substrate (4) from the other side and a scribe region (3) surrounding the circumference of the structure material (6) are etched at the same time to cut out a semiconductor chip (2).