发明名称 URETHANE-BASED RESIN MATERIAL AND HEAT CONDUCTIVE MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a urethane-based resin material which is highly heat resistant, low in hardness and viscous, gives moldings having smooth surfaces and exhibits controlled oil bleed and a heat conductive material based on the urethane-based resin material. <P>SOLUTION: The urethane-based resin material is a blend of 75-300 pts.wt. of an olefinic oil and 1.5-225 pts.wt. of a liquid antioxidant to 175 pts.wt. of a polyurethane. Preferably, the liquid antioxidant is a hindered phenol-based antioxidant with a melting temperature of &le;10&deg;C. More specifically, use of benzene propanoic acid, 3,5-bis(1,1-dimethylethyl)-4-hydroxy-alkylester having 7-9C side chains is recommended. The heat conductive material is obtained by mixing 180-580 pts.wt. of a heat conductive filler with 100 pts.wt. of the urethane-based resin material. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007091858(A) 申请公布日期 2007.04.12
申请号 JP20050282237 申请日期 2005.09.28
申请人 KITAGAWA IND CO LTD 发明人 SAKAI MITSUYOSHI;KAWAGUCHI YASUHIRO
分类号 C08L75/04;C08K3/00;C08K5/13;C09K5/08;C09K15/08 主分类号 C08L75/04
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