| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of processing a wafer which can achieve efficiency of a process in which only a device region surrounded by an external peripheral margin region is thinned and the device region is divided to obtain a plurality of devices, and can perform a device dividing operation similarly to a usual method. SOLUTION: A protective tape 7 in which its adhesive strength is deteriorated due to UV ray irradiation is pasted on the surface of a wafer 1, and subsequently, a portion corresponding to a device region 5 of a backside is ground, and a thick reinforcing portion 8 is formed on a portion corresponding to the external peripheral margin region 6. Next, the reinforcing portion 8 is cut, only the portion where the protective tape 7 is pasted on the reinforcing portion 8 is irradiated with an UV ray, and an external force is applied to separate the reinforcing portion 8 from the device region 5. Then, a dicing frame 42 is attached on the rear surface of the wafer 1 where only the device 5 exists via a dicing tape 41, and the wafer 1 is divided into semiconductor chips 3. COPYRIGHT: (C)2007,JPO&INPIT |
