| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of a double mold structure which ensures insulating properties, has an excellent heat radiation, and can be made small; and to provide its manufacturing method and an electronic apparatus mounting such a semiconductor device. SOLUTION: A primary resin seal 9 is formed by a primary mold with a translucent resin so as to involve a light emitting element 2 and a light receiving element 3 positioned optically. The light emitting element 2 and the light receiving element 3 are positioned at a high accuracy. Under the state that a heat radiator 11 is brought into close contact with the primary resin seal 9 for mounting, a secondary resin seal 10 is formed on the outer periphery of the primary resin seal 9 by a secondary mold with a shading resin, and the heat radiator 11 is also embedded in the secondary resin seal 10. COPYRIGHT: (C)2007,JPO&INPIT |
