| 摘要 |
PROBLEM TO BE SOLVED: To provide a dry etching device capable of symmetrically working both sides of a working sectional shape in the in-plane whole region of a body to be etched when a dry etching working is conducted by generating a plasma. SOLUTION: The dry etching device has a second plasma source 21 in a region different from a first plasma source 19 and a plasma generating region. The dry etching device has two kinds of plasma sources having the different plasma directivity of a first plasma generated by the first plasma source 19 and the different plasma directivity of a second plasma generated by a second plasma source 21. COPYRIGHT: (C)2007,JPO&INPIT
|
