| 摘要 |
PROBLEM TO BE SOLVED: To thin an electronic part package. SOLUTION: The structure of the electronic part package is equipped with a substrate 6, a projection electrode 7 formed in the upper side of the substrate 6, an electronic part 8 packaged in the substrate 6 through the projection electrode 7, and a protector 9 made of resin which covers the periphery of the electronic part 8 on the substrate 6. The thinning of the electronic part package can be attained by making the upper surface of the electronic part 8 be a polish side and the lower surface be a functional side, because the upper surface of the protector 9 made of resin and the electronic part 8 can be sufficiently polished. COPYRIGHT: (C)2007,JPO&INPIT
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