| 摘要 |
A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises a conjugate addition product of an amine and an unsaturated reactant in the form of a beta-amino-ester or beta-amino-amide intermediate. The composition when coated on fiberglass is cured to form a water-insoluble polyamide or polyimide binder which exhibits good adhesion to glass. In a preferred embodiment the fiberglass is in the form of building insulation. In other embodiments the product is a microglass-based substrate for use in a printed circuit board, battery separator, filter stock, or reinforcement scrim.
|
