发明名称 SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SAME
摘要 [PROBLEMS] To provide a semiconductor substrate having an alignment mark which can be used for alignment even after an impurity diffusion layer is formed by planarizing an epitaxial film. [MEANS FOR SOLVING PROBLEMS] A trench (11) is formed in an alignment region of an N<SUP>+</SUP> substrate (1), and a void (3) is left after forming an N<SUP>-</SUP> layer (2) by using the trench (11). The void (3) formed on the N<SUP>+</SUP> substrate (1) can be used as an alignment mark. Thus, alignment in the subsequent semiconductor device manufacturing steps can be performed by using such semiconductor substrate, and each element constituting a semiconductor device can be accurately formed at a desired position.
申请公布号 WO2007040255(A1) 申请公布日期 2007.04.12
申请号 WO2006JP319933 申请日期 2006.10.05
申请人 SUMCO CORPORATION;DENSO CORPORATION;NOGAMI, SYOUJI;YAMAOKA, TOMONORI;YAMAUCHI, SHOICHI;TSUJI, NOBUHIRO;MORISHITA, TOSHIYUKI 发明人 NOGAMI, SYOUJI;YAMAOKA, TOMONORI;YAMAUCHI, SHOICHI;TSUJI, NOBUHIRO;MORISHITA, TOSHIYUKI
分类号 H01L21/027;G03F7/20;H01L21/205;H01L29/06;H01L29/78 主分类号 H01L21/027
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