摘要 |
Deflection measuring apparatus and methods are used to prevent overstress of printed circuit boards (PCB) prior and during testing. They can be used to verify in a HALT, HASS of ESS testing protocol, if the PCB testing fixture a nd vibration testing setup would be likely to cause failure of PCB components during pre- testing and testing procedures, which failure would otherwise no t occur with faultless components. Furthermore, In the context of a PCB to be integrated to a system as a product such as a computer, the deflection measuring apparatus and methods are used to prevent overstress of PCBs at th e system assembly stage, to ensure that operations involved, such as plugging of PCB connectors, will not cause PCB components failure, which would otherwise not occur with faultless components.
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