发明名称 USED ETCHING GAS TREATING METHOD AND USED ETCHING GAS TREATMENT APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To greatly reduce an amount of drain by recycling water generated when treating used etching gas. <P>SOLUTION: This treatment apparatus 100 is provided with: a detoxifying facility 74 for burning used etching gas discharged from an etching apparatus 72; a scrubber 53 for producing hydrogen fluoride by bringing water into contact with gas discharged from the detoxifying facility 74 and causing a reaction; a reactor 20 for reacting hydrogen fluoride generated in the scrubber 53 with a calcium compound to form a calcium fluoride-containing treating solution 22; a treatment tank 30 for separating solid from liquid by membrane filtration of the calcium fluoride-containing treating solution 22 from the forming tank 20; a filter press 36 for recovering calcium fluoride precipitated in the treatment tank 30; a regeneration tank 40 forming hydrogen fluoride by adding an acid to the calcium fluoride recovered in the filter press 36 and causing a reaction; and a water recycling line for returning filtrate filtered in the treatment tank 30 to the scrubber 53. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007090174(A) 申请公布日期 2007.04.12
申请号 JP20050280892 申请日期 2005.09.27
申请人 SANYO ELECTRIC CO LTD 发明人 TAIHICHI MOTOYUKI;MOGI KAZUTOSHI;IZEKI MASAHIRO;UMEZAWA HIROYUKI;KOIZUMI TOMOHITO
分类号 B01D53/70;C02F1/44;C02F1/58;F23G7/06 主分类号 B01D53/70
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