| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve a structure wherein a SAW element indicates stable and high characteristics in flip-chip packaging of the SAW element on a ceramic multilayered substrate. <P>SOLUTION: A SAW element 21 is packaged on a ceramic multilayered substrate 10 by Au-Au bonding while confronting its interdigital electrode formation surface 28 to a component packaging surface 11 of the multilayered substrate 10 so as to form a cavity in a gap with the component packaging surface. When sealing the SAW element using a sealing member 30, the SAW element 21 is covered and sealed in the state of protecting and securing the cavity. Furthermore, any component, conductor pattern or conductor layer including the SAW element 21 is not formed in a conductor arrangement prohibited area 14 within 100μm from the vicinity of the multilayered substrate 10. Moreover, a high frequency module component 15 is provided on a bottom surface of the multilayered substrate 10 and no conductor is formed on a side surface thereof. Thus, the sealing member 30 and the multilayered substrate 10 are strongly bonded in the conductor arrangement prohibited area 14, thereby forming the high frequency module component 1 which is strong structurally and stabilizes characteristics. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
