| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder resist suitable for use as an insulating protective film of a printed wiring board, having such high flame retardancy as to satisfy UL standards, and excellent in heat resistance in soldering, breaking resistance and high-temperature reliability. <P>SOLUTION: A solder resist composition contains 8-60 parts by mass of a condensed phosphate ester and 38-150 parts by mass of aluminum hydroxide, based on 100 parts by mass of a base blend comprising 48-67 parts by mass of a carboxyl modified epoxy (meth)acrylate resin having an acid number of 90-110 mgKOH/g obtained by reacting a bisphenol type epoxy resin with (meth)acrylic acid and then with an acid anhydride, 7-10 parts by mass of a (meth)acrylate monomer, 7-14 parts by mass of a photopolymerization initiator, 16-31 parts by mass of an epoxy resin and 1-7 parts by mass of a heat polymerization catalyst. <P>COPYRIGHT: (C)2007,JPO&INPIT |
