INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problem caused by the accumulation of heat generated from an integrated circuit. SOLUTION: This integrated circuit device includes a substrate on one surface of which the integrated circuit is formed. The other surface of the substrate (a surface on which the integrated circuit is not formed) includes a depressed portion and has a larger surface area than the one of the other surface. The depressed portion formed on the other surface is filled with a heat radiation material, or a film containing a heat radiation material is formed at least over the surface of the depressed portion. Such integrated circuit devices may be provided in a multilayer structure. COPYRIGHT: (C)2007,JPO&INPIT