| 摘要 |
PROBLEM TO BE SOLVED: To enhance adhesion between an insulation layer and a conductor portion of a circuit board. SOLUTION: The circuit board comprises a plurality of wiring layers, an insulation layer 20 having a fibrous filler and a resin 24 and insulating the plurality of wiring layers, and a conductor portion 41 formed on the sidewall 30a of a via 30 penetrating the insulation layer 20. The fibrous filler projecting from the sidewall 30a and contained in the conductor portion 41 has a length X longer than the film thickness Z of the conductor portion 41. Consequently, adhesion between the insulation layer and the conductor portion can be enhanced and a highly reliable circuit board can be provided. COPYRIGHT: (C)2007,JPO&INPIT
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