发明名称 MULTILAYER MOLD-RELEASING FILM
摘要 PROBLEM TO BE SOLVED: To provide a multilayer mold-releasing film which can be easily disposed of after use, and which can suppress the formation of a void during thermal press molding, the outflow of an adhesive and the exudation of a cushion layer resin on a film end surface, while having heat resistance, mold release characteristics and the property of following a surface of a substrate. SOLUTION: This multilayer mold-releasing film comprises at least a mold-releasing layer which consists of a crystalline aromatic polyester resin with a 200°C or more melting point measured by using a differential scanning calorimeter, and a cushion layer which consists of a polyolefin resin with a melt flow rate of 7 g/10 min or less and a 70-130°C melting point measured by using the differential scanning calorimeter. The thickness of the mold-releasing layer is in the range of 5-50μm. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007090644(A) 申请公布日期 2007.04.12
申请号 JP20050282477 申请日期 2005.09.28
申请人 SEKISUI CHEM CO LTD 发明人 TSUCHIYA MASAHIRO;GOTO YASUSHI;MATSUMOTO HIROTAKE
分类号 B32B27/32;B32B27/00 主分类号 B32B27/32
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