METHOD OF CUTTING FILM MATERIAL HAVING ADHESIVE MATERIAL LAYER, AND SLITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of cutting a film material having an adhesive material layer and a slitting device capable of effectively avoiding peeling of the adhesive material layer from a substrate when cutting the film material having the adhesive material layer to a narrow width. SOLUTION: The film material 20 having an adhesive material layer continuously let out is heated by spraying a warm air from a warm air blower 33 installed so that a blowout port 33a is positioned at the right under a cutting blade unit 30, and cut in such a state that a contact boundary face with a substrate of at least adhesive material layer is soften. COPYRIGHT: (C)2007,JPO&INPIT