发明名称 |
INTERCONNECTS AND HEAT DISSIPATORS BASED ON NANOSTRUCTURES |
摘要 |
The present invention provides for nanostructures grown on a conducting substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and heat dissipators in electronic devices. |
申请公布号 |
WO2007024186(A3) |
申请公布日期 |
2007.04.12 |
申请号 |
WO2006SE00983 |
申请日期 |
2006.08.28 |
申请人 |
SMOLTEK AB;KABIR, MOHAMMAD, SHAFIQUI |
发明人 |
KABIR, MOHAMMAD, SHAFIQUI |
分类号 |
D01F9/127;D01F9/08;H01L21/04;H01L23/373;H01L51/00 |
主分类号 |
D01F9/127 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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