发明名称 INTERCONNECTS AND HEAT DISSIPATORS BASED ON NANOSTRUCTURES
摘要 The present invention provides for nanostructures grown on a conducting substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and heat dissipators in electronic devices.
申请公布号 WO2007024186(A3) 申请公布日期 2007.04.12
申请号 WO2006SE00983 申请日期 2006.08.28
申请人 SMOLTEK AB;KABIR, MOHAMMAD, SHAFIQUI 发明人 KABIR, MOHAMMAD, SHAFIQUI
分类号 D01F9/127;D01F9/08;H01L21/04;H01L23/373;H01L51/00 主分类号 D01F9/127
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