| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board with built-in components and a manufacturing method thereof suitable for reducing the manufacturing burden, and also suitable for embedding small components. <P>SOLUTION: This wiring board with built-in components comprises a first insulating layer; a wiring pattern provided on one surface side of this first insulating layer; electric/electronic components mounted on/connected to this wiring pattern; a second insulating layer located oppositely to and spaced apart from the first insulating layer and having escape portions penetrating it in the layer-thickness direction corresponding to the locations, wherein the electric/electronic components are mounted and at least part of the surface thereof on the side opposite to the side facing the first insulating layer is opened; and a third insulating layer so provided that the clearance between the first insulating layer and the second insulating layer spaced apart therefrom is filled with the third insulating layer, and the electric/electronic components are surrounded by and the escape portions are also filled with the third insulating layer. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
