| 摘要 |
PROBLEM TO BE SOLVED: To prevent a wafer from being damaged during transportation, etc. by preventing adhesion of grinding waste to the front face of the wafer at grinding of the rear face thereof, in the processing the wafer formed with projections on the front face. SOLUTION: In this wafer processing method after the rear face of the wafer 10 which is formed with a plurality of projections on the front face is ground by a grinding stone 35, the wafer 10 is cut by a cutting blade. First, in a ring-attaching process, a reinforcing ring 13, having nearly the same thickness as the projections, is attached in the periphery of the front face of the wafer 10. Next, in a rear-face grinding process, a protective tape 25 is pasted to the front-face side of the wafer 10 where the reinforcing ring 13 is attached, and then the rear face of the wafer 10 is ground. In the cutting process, after the rear face grinding process, the protection tape 25 is peeled off from the front face of the wafer 10, then a dicing tape is pasted to the rear face of the wafer 10, and finally the wafer 10 is cut from the front-face side. COPYRIGHT: (C)2007,JPO&INPIT |
