| 摘要 |
PROBLEM TO BE SOLVED: To provide an excellent one pack-type epoxy resin composition having both of high curability and extremely high storage stability; to provide a latent curing agent for obtaining the composition; and to provide an anisotropic electroconductive material, an electroconductive adhesive material, an insulation adhesive material, an encapsulant or the like providing high reliability of connection and sealing properties even under a curing condition of a low temperature or a short time. SOLUTION: The microcapsule-type curing agent for an epoxy resin is obtained by microencapsulating a curing agent for the epoxy resin characterized by≤15,000 weight average molecular weight of an amine adduct, >1 and≤7 molecular weight distribution defined by the ratio of the weight average molecular weight to the number average molecular weight of the amine adduct, and <0.001 pt.mass content of a low-molecular weight amine compound based on the amine adduct. The epoxy resin composition contains the curing agent. COPYRIGHT: (C)2007,JPO&INPIT |
