| 摘要 |
PROBLEM TO BE SOLVED: To carry out annunciation allowing ready and accurate recognition of a cause of solder pattern misalignment. SOLUTION: A substrate after solder printing is imaged, a misalignment amount of solder printing is detected for each axial direction of x and y for each land on an image, and a vector (average value vector) which is a combination of an average value of the pattern misalignment amounts is set. Furthermore, the substrate on an image is divided into a plurality of regions, and a vector (vector inside a region) is set based on the pattern misalignment amount detected in a region thereof each for each region. In a monitor, a screen 40 is displayed comprising a pattern diagram 55 of the substrate showing the division state of the region and a window 41 for display. Each vector inside a region is displayed in a corresponding region 56 in the pattern diagram 55 each, and an average value vector is displayed inside the window 41. COPYRIGHT: (C)2007,JPO&INPIT
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