| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink apparatus, equipped with a structure where an interval between a semiconductor element and a radiator can finely be adjusted, in matching with the height of the semiconductor element, using a simple structure. SOLUTION: In the heat sink apparatus radiates heat in the semiconductor element mounted on a printed circuit board, there is provided with a spacer in which an inclination face is installed, and which is fitted to the printed circuit board near the semiconductor element; and with the radiator; in which an inclination face whose direction is the same as that of the spacer is arranged, and which is fitted to the spacer and radiates heat of the semiconductor element. COPYRIGHT: (C)2007,JPO&INPIT
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