发明名称 CONDUCTIVE PASTE AND METHOD OF MANUFACTURING SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste which suppresses the occurrence of cracks due to a thickened film than before while lowering resistance, and to provide a method of manufacturing the same. SOLUTION: In the conductive paste formed by dispersing metal ultra-fine particles in an organic solvent, using a metal core formed of metal component originating from metal salt and metal ultra-fine particles originating from the metal salt and having organic component covering the periphery of the meal core, the organic component originating from the metal salt and remaining after composing the metal ultra-fine particles is contained in the organic solvent. The paste is suitably provided by heating a solution formed by dissolving or dispersing the metal salt in an organic solvent for composition, reducing the metal salt to produce the metal ultra-fine particles, condensing the composite solution and mixing the condensed composite solution with the organic solvent to disperse the metal ultra-fine particles. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007095527(A) 申请公布日期 2007.04.12
申请号 JP20050284188 申请日期 2005.09.29
申请人 TOKAI RUBBER IND LTD 发明人 TERASAKI SHINGO;SATO AKIO;KANBE YUMI;BESSHO HISAMI
分类号 H01B1/22;B22F1/02;C09C1/62;C09C3/00;C09D17/00;H01B13/00 主分类号 H01B1/22
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