发明名称 COMPOSITION FOR USE IN FILM FORMATION, INSULATION FILM, AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a composition which is capable of forming a silicone-based film that is usable suitably as an interlayer insulation film in a semiconductor element or the like and has an appropriate uniform thickness and besides is excellent in the dielectric constant characteristics and film strength, and to provide an insulation film and also a manufacturing method thereof. SOLUTION: The composition for use in film formation contains a compound which has m numbers of RSi(O<SB>0.5</SB>)<SB>3</SB>units (wherein, m is an integer of 8-16; and R is a nonhydrolyzable group) and besides which forms a cage structure as the result that each one of units shares an oxygen atom in each one of units and thus connects to another unit, and/or contains a reaction product thereof. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007092019(A) 申请公布日期 2007.04.12
申请号 JP20060048811 申请日期 2006.02.24
申请人 FUJIFILM CORP 发明人 MORITA KENSUKE
分类号 C09D183/04;C08L83/04;C09D1/00;C09D5/25;C09D7/12;C09D183/10;H01L21/312 主分类号 C09D183/04
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