发明名称 THERMOSETTING RESIN COMPOSITION AND THERMOSETTING RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition having an extremely high curing rate and a thermosetting resin molding material. SOLUTION: The thermosetting resin composition comprises a novolak type phenol resin (a), hexamethylenetetraamine (b) and a hydrogen ion-releasing polymer (c) as essential components. In the thermosetting resin composition, the hydrogen ion-releasing polymer (c) is a hydrogen type cation exchange resin. In the thermosetting resin composition, the hydrogen ion-releasing polymer (c) contains a sulfonic acid group as a functional group. The thermosetting resin molding material comprises the thermosetting resin composition and a filler. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007091820(A) 申请公布日期 2007.04.12
申请号 JP20050280514 申请日期 2005.09.27
申请人 SUMITOMO BAKELITE CO LTD 发明人 TAKIHANA YOSHIHIRO
分类号 C08L61/10;C08K5/3477;C08L101/02 主分类号 C08L61/10
代理机构 代理人
主权项
地址