发明名称 |
METHOD OF RELEASING HIGH TEMPERATURE FILMS AND/OR DEVICES FROM METALLIC SUBSTRATES |
摘要 |
<p>Films and electronic devices can be released from metallic substrates by: (i) applying a coating of a polysilsesquioxane resin to a metallic substrate, (ii) heating the coated metallic substrate to a temperature sufficient to cure the polysilsesquioxane resin, (iii) applying a polymeric film to the cured coating on the metallic substrate, (iv) further heating the coated metallic substrate to a temperature sufficient to cure the polymeric film, (v) optionally fabricating electronic devices on the polymeric film, and (vi) releasing the polymeric film from the metallic substrate.</p> |
申请公布号 |
WO2007040870(A1) |
申请公布日期 |
2007.04.12 |
申请号 |
WO2006US33548 |
申请日期 |
2006.08.30 |
申请人 |
DOW CORNING CORPORATION;ANDERSON, NICOLE;KATSOULIS, DIMITRIS ELIAS;ZHU, BIZHONG |
发明人 |
ANDERSON, NICOLE;KATSOULIS, DIMITRIS ELIAS;ZHU, BIZHONG |
分类号 |
C09J7/00 |
主分类号 |
C09J7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|