| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lithography apparatus and an internal space adjustment method of device manufacturing apparatus. <P>SOLUTION: The lithography apparatus comprises at least a first gas shower constituted so as to supply a first air current into an internal space of the lithography apparatus, and at least a second gas shower constituted so as to supply a second air current into the internal space of the lithography apparatus, wherein the first and second air currents are at least partially directed to one another by the gas shower. Further, there is provided a method of adjusting the internal space of a device manufacturing apparatus, wherein the first adjusted air current and the second adjusted air current are supplied to the internal space, so that they are at least partially directed to one another. <P>COPYRIGHT: (C)2007,JPO&INPIT |
