发明名称 WAFER CARRIER AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a wafer carrier capable of surely removing water droplets without damaging a wafer upon its cleaning. SOLUTION: The wafer carrier for accommodating a plurality of wafers comprises, in order to release and dry water droplets adhering to the wafer W by an apparatus using centrifugal force, a set of holders 11a, 11b having a plurality of grooves for holding the plurality of the wafers W in parallel at a predetermined interval; supporters 12a, 12b for supporting, by fixing, these holders 11a, 11b; and stoppers 13a, 13b for stopping the wafers so as to prevent the wafers W flying out from the holders 11a, 11b when applying the centrifugal force thereto. The stoppers 13a, 13b consist of a contact C with the wafer W formed into a plate shape, and consist of an elastic part S other than the contact, formed with an elastic metal plate having a plurality of holes drilled therethrough and configured in a lattice shape. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007095781(A) 申请公布日期 2007.04.12
申请号 JP20050279969 申请日期 2005.09.27
申请人 OKI ELECTRIC IND CO LTD;MIYAGI OKI ELECTRIC CO LTD 发明人 SASAKI TAKEHIKO
分类号 H01L21/673;H01L21/304 主分类号 H01L21/673
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