| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit component-mounted device that can inhibit a solder bridge phenomenon. SOLUTION: The circuit component-mounted device has a resin substrate 11, an electrode pair 12 prepared on the resin substrate 11 so as to oppose each other, a circuit component 13 prepared on the electrode pair 12 and composed of a main body 13a and an electrode 13b, solder 14 bonding the electrode pair 12 and the electrode 13b of the circuit component 13, and insulating sealing resin 15 covering the circuit component 13 and the solder 14, wherein depression 17 is formed on the electrode pair 12 at a side adjacent to the electrode 13b of the circuit component 13 on the electrode pair 12, the depression 17 that is smaller than the electrode 13b and extends to the opposing region of the electrode pair 12 is formed. COPYRIGHT: (C)2007,JPO&INPIT
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