摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition having an extremely high curing rate and hardly causing voids in a cured product and a thermosetting resin molding material using the same. SOLUTION: The thermosetting resin composition comprises a novolak type phenol resin (a), a benzoxazine compound (b) and a hydrogen ion-releasing polymer (c) as essential components. In the thermosetting resin composition, the hydrogen ion-releasing polymer (c) is a hydrogen type cation exchange resin. In the thermosetting resin composition, the hydrogen ion-releasing polymer (c) contains a sulfonic acid group as a functional group. The thermosetting resin molding material comprises any of the thermosetting resin compositions and a filler. COPYRIGHT: (C)2007,JPO&INPIT
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