发明名称 Lötaufbau zwischen einem Streifen einer Stromschiene und einem bedruckten Substrat
摘要 A soldering structure between a tab of a bus bar and a printed substrate is disclosed to provide a soldering structure between a tab of a bus bar and a printed substrate that causes no crack. An electrical conductive material is formed on a printed substrate. A tab through-hole is provide to penetrate the electrical conductive material and printed substrate. A tab formed by bending a body of the bus bar enters the tab through-hole. A periphery of the tab and the electrical conductive material are interconnected by soldering. A stress-absorbing aperture or recess is provided in an insulation plate on which the body of the bus bar is mounted. The stress-absorbing aperture or recess can absorb an axial stress caused in the tab.
申请公布号 DE102004041173(B4) 申请公布日期 2007.04.12
申请号 DE20041041173 申请日期 2004.08.25
申请人 SUMITOMO WIRING SYSTEMS LTD. 发明人 HIWATASHI, HIROKAZU
分类号 H01R4/02;H01R12/55;H01R43/02;H02G3/16;H05K3/20;H05K3/34;H05K7/06 主分类号 H01R4/02
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