| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a downsized LED lighting device that maintains high heat dissipation-properties. <P>SOLUTION: The LED lighting device comprises an LED chip, a thermal conductivity frame on which the LED chip is mounted, a pair of lead frames to which an electrode of the LED chip is connected, and a reflector for covering part of the thermal conductivity frame and part of the lead frames and forming a cup shaped reflection plane around the LED chip. The light emitting direction of the LED chip is substantially perpendicular to the extending direction of the lead frames. <P>COPYRIGHT: (C)2007,JPO&INPIT |
